I AM HP BOND REPAIR SH

Hello Ieonie, thank you for your inquiry. The ingredients are as follows:

Aqua, Cetearyl Alcohol, Stearamidopropyl Dimethylamine, Behentrimonium, Chloride, Citric Acid, Panthenol, Hydrolyzed Pea Protein, Hydrolyzed, Corn Protein, Hydrolyzed Soy Protein, Hydrolyzed Wheat Protein, Ethylhexyl Stearate, Hydroxypropyl Guar Hydroxypropyltrimonium Chloride, Cetrimonium Chloride, Selaginella Lepidophylla Extract, Leuconostoc/Radish Root Ferment Filtrate, Polyquaternium-80, PEG-90M, Hydroxyethylcellulose, Dipropylene Glycol, Silica, Calcium Carbonate, Sodium Nitrate, Parfum, Limonene, Linalool, Hexyl Cinnamal, Sodium Benzoate, Phenoxyethanol.

We have taken your suggestion to post these online and are now looking into it. Best regards, your M-Infoline team